温度对金刚石粉体表面镀铜的影响

Effect of temperature on electroless copper plating onto the surface of diamond powder

在金刚石粉体表面通过化学沉积得到铜金属镀层,通过X射线衍射（XRD）、扫描电镜（SEM）等测试手段研究了镀液温度对镀速、镀层组织及形貌的影响。结果表明：当镀液温度低于30℃时,镀速为零,反应不能发生;温度在30～45℃时,随着温度的升高,铜的衍射峰逐渐增强;45℃时,基体完全被覆盖,镀层致密均匀;温度在45～50℃时,衍射峰进一步增强,镀层晶粒明显变大,致密度降低,表层有脱落现象;随着温度进一步增大,铜的衍射峰强度开始降低,60℃时,镀层有明显的脱落,翻边起皮现象。

The copper coating were deposited on the surface of diamond powder using chemical deposition.The plating rate,organization and surface morphology were changed by the temperature of plating bath,which was investigated through X-ray diffraction technique and scanning electron microscope analysis.The results showed that the plating rate was zero and no reaction could occur when the temperature was lower than 30℃.The intensity of copper peak strengthened with the increase of the temperature when the temperature was in the range of 30-45 ℃.The substrate was coating of copper completely,and the coating was uniform and dense when the temperature was 45℃.The copper peak intensity was further enhanced,the grain size was significantly larger,the coating density decreased and had a exfoliation phenomenon when the temperature was at 45-50℃.The copper peak intensity weakened with the increasing of the temperature when the temperature was above 50℃.The plating had an obvious exfoliation and edge curl phenomenon when the temperature was at 60℃.