表面贴装集成电路引脚整形研究

The Study of Reforming Pins for Surface Mount Integrated Circuit

微电子技术的迅猛发展,促进了电子器件和电子产品小型化的发展。目前,表面贴装集成电路(SMIC)已成为主流封装形式,此类封装集成电路具有集成度高、管脚多、间距小等特点,在生产上满足了向小型化发展的需求,但是也带来了很多问题,其中引脚共面性问题为常见的问题之一。结合SMIC在使用过程中因引脚共面性引起的焊接问题,对SMIC的引脚整形试验展开研究。

With the rapid development of microelectronics technology, electronic devices and electronic products are becoming more and more miniaturized. Currently, surface mount integrated circuit （SMIC） has become a mainstream form of encapsulation, such packaged integrated circuit are highly integrated with multi-pins and fine pitch. This encapsulation form meet the miniaturization development needs for users, but it also brings a lot of problems, such as lead coplanarity issue. In consideration of the problem of coplanarity, there is a study for reforming the pins of SMIC with the is needed. purpose of improving the reliability of solderability