保偏光纤耦合器新型封装材料的稳定性研究

Study Stabilization of New Encapsulation Material of Polarization Maintaining Fiber Coupler

分析了以往保偏光纤耦合器封装工艺存在的一些技术缺陷,以及在试验过程中这些缺陷对保偏光纤耦合器造成的不良影响。针对存在的问题,提出了一种新的高稳定性的材料——低温玻璃封装用于耦合器的封装,经过一系列实验(工作温度,高温寿命,交变湿热,温度冲击),并对实验结果分析,新的封装基本达到预期目标。

The defects of old packaging technique and its detrimental influence on polarization maintaining fiber coupler in experiments are analyzed. To solve this problem, high stability packing material is proposed, which is a new packaging process. Experimental results including working temperature, high temperature lifetime, high humidity and quick temperature changing, demonstrate that the new packaging process is satisfactory.