工艺条件对电沉积Cu-SiO_2复合镀层形貌与硬度的影响

Effects of Process Conditions on Morphology and Hardness of Electrodeposited Cu-SiO_2 Composite Coating

采用电沉积方法制备Cu-SiO2复合镀层,并研究了搅拌速率、电流密度和电流施加方式对其形貌与硬度的影响。结果显示:随着搅拌速率的提高,复合镀层的形貌先趋好后变差,硬度先升高后降低;而随着电流密度的增加,复合镀层的形貌呈现逐渐变差的趋势,硬度近似线性降低;在同等条件下,电流以脉冲形式施加有利于改善复合镀层的形貌,密实组织结构,提高硬度。

The Cu-SiO2 composite coating was prepared by electrodeposition,and the effects of agitation rate,current density and current applying way on its morphology and hardness were investigated.The results show that with the increasing of agitation rate,the morphology of the composite coating is improved first and then becomes worse,and the hardness increases first and then decreases; with the increasing of current density,the morphology of the composite coating shows a gradually worsening trend,and the hardness reduces almost linearly; under the same conditions,the current applied in pulse form is better for improving the morphology,compacting the structure and increasing the hardness of the composite coating.