摘要
以N-乙烯基咪唑、1,3-丙基磺酸内酯和丙烯酸丁酯为原料,合成一种聚乙烯基咪唑镏季铵类整平剂.采用红外光谱和核磁共振谱对其进行表征.将该整平剂与聚二硫二丙烷磺酸钠（SPS）和聚乙二醇（PEG8000）组成添加剂体系,测试该体系的电化学性能和电镀性能.结果表明：该体系对铜的阴极还原产生极大的极化作用,并使镀液在较宽的电流密度范围内（0.2～10.2 A/dm2）均得到光亮平整的铜层,而且能很好地提高镀液的分散能力和深镀能力,说明合成的共聚物是一种性能良好的电镀整平剂.
A leveling agent of polyvinyl imidazole quaternary amine onium salt type was synthesized with N-vinylimidazole,1,3-propyl sultone and butylacrylate as raw materials.The leveling agent was characterized by FT-IR and HNMR spectroscopy.An additive system consisting of this leveling agent,sodium 3,3＇-dithiodipropane sulfonate（SPS） and polyethylene glycol （PEG8000） was prepared,and the electrochemical performance and plating performance of this system were tested.The results show that the additive system can produce a great polarization effect on the cathode reduction of copper,can make the bath to obtain a bright and smooth copper coating in a wider range of current density （0.2～10.2 A/dm2）,and can also improve the throwing and covering power of plating bath greatly,which indicates that the synthesized copolymer is an electroplating leveling agent with good performance.
出处
《电镀与环保》
CAS
CSCD
北大核心
2014年第5期19-23,共5页
Electroplating & Pollution Control
关键词
酸性镀铜
整平剂
电化学性能
电镀性能
acid copper plating
leveling agent
electrochemical performance
plating performance
