摘要
绝缘栅双极晶体管(IGBT)是电力电子领域中最重要的大功率器件,大规模应用于电动汽车、电力机车等领域。陶瓷覆铜板既具有陶瓷的高导热性、高电绝缘性、高机械强度、低膨胀等特性,又具有无氧铜金属的高导电性和优异的焊接性能,是IGBT功率模块封装的不可或缺的关键基础材料。本文介绍了陶瓷覆铜板中陶瓷基板材料和覆铜技术的研究现状,并展望了陶瓷覆铜板在下一代功率模块上的应用前景。
IGBTs are the most important high power devices in power electronics, which are used in e- lectric vehicles, electric locomotives and other fields. Ceramic substrateswith bonded copper have high thermal conductivity, high electrical insulation, high mechanical strength, low expansion coefficient, high conductivity and excellent welding performance of oxygen free copper. It is the indispensable key funda- mental materials for IGBT power modules packaging. The current status of the research on ceramic sub- strate material and copper metallization technology is introduced, and the application of ceramic substrates- with bonded copperin next-gen power modulesis prospected.
出处
《真空电子技术》
2014年第5期17-20,24,共5页
Vacuum Electronics
关键词
陶瓷覆铜板
陶瓷基板材料
覆铜
功率模块
Ceramic bonding copper
Ceramic substrates
Copper metallization
Power modules
