摘要
通过对烧结Ni的改进,发现掺杂Ag的复合烧结Ni效果更好。它不会发生电镀Ni造成的Ni层起泡,以及封接强度低的问题;也能避免烧结Ni容易漏气的问题。
By impoving the process of Ni paint, it is found that the effect realized by doping Ag is better than that by traditional method. The air bubble and low seal strength can be avoided. And the leakage of the devices can also be avoided.
出处
《真空电子技术》
2014年第5期66-71,共6页
Vacuum Electronics