化学镀镍微道沟超级填充工艺

Bottom-Up Filling Process for Submicron Trenches by Electroless Nickel Plating

在次磷酸钠化学镀镍溶液中研究共同添加3-巯基丙烷磺酸钠和聚乙烯亚胺-5000对化学镀镍的影响,通过线性扫描伏安法研究了添加剂对阳极、阴极极化曲线的影响。结果表明,随着3-巯基丙烷磺酸钠浓度的增加,化学镀镍平均速率增大,当ρ(3-巯基丙烷磺酸钠)达到5mg/L时镀镍平均沉积速率达到最大,在此溶液中继续添加聚乙烯亚胺-5000,发现沉积速率下降,且比单独添加聚乙烯亚胺-5000还小。利用3-巯基丙烷磺酸钠对化学镀镍的加速作用和聚乙烯亚胺-5000的抑制作用,以及其在溶液中低的扩散系数,成功实现了化学镍的完全协同填充。

Effects of co-adding of 3-mercapto propanesulphonate Sodium （MPS） and polyethylene imine-5000 （PEI-5000） on electroless nickel plating were studied in sodium hypophosphite system. Effects of the additives on anodic and cathodic polarization curves were investigated by linear sweep voltammetric method. Results showed that nickel average deposition rate would increase with the increasing of MPS concentration, and reached to a maximum value when the MPS concentration was 5 mg/L;but when continue adding more PEI-5000 to the bath, it was found that the deposition rate would decrease and even less than that of when adding PEI-5000 only. With the acceleration function of MPS, and inhibition function of PEI-5000, as well as low diffusion coefficient in the bath, completely collaborative bottom-up filling for submicron trenches by electroless nickel plating was implemented successfully.