敏感陶瓷表面溅射金属化研究

Metalization of Sensitive Ceramics via Magnetron Sputtering

以负温度系数(NTC)热敏陶瓷为例,采用直流磁控溅射技术在陶瓷表面制备了过渡层+阻挡层+焊接层的复合溅射膜电极,其中Ni-V薄膜作为过渡层兼阻挡层,Ag作为焊接层。并对NTC热敏陶瓷的各项电性能,电极的结合力等进行了测试,采用扫描电镜、能量色散X射线谱等技术研究了溅射膜电极的作用机理和微观形貌。实验结果表明:Ni能与NTC热敏陶瓷产生良好的欧姆接触,并提高了电极层与陶瓷表面的附着力,而且Ni膜能够有效阻挡Ag扩散进入陶瓷体内,避免了烧银电极中Ag向瓷体内扩散的缺点,同时Ni还能很好地耐受高温无铅焊锡的溶蚀,保证焊接质量。

Here,weaddressed the metallization of negative temperature coegicient（NTC）thermal sensitive ceramics. The multilayered Ni/V-Ag thin films, consisting of a Ni-V transition and diffusion barrier layer（500 nm）and Ag welding layer（200 nm）, were deposited successively on substrate of NTC ceramics by magnetron sputtering. The microstructures and interface adhesion of the muhilayers and electrical properties of the NTC ceramics were characterized with scanning electron microscopy,and energy dispersive X-ray spectroscopy. The results show that the Ni-layer makes a good Ohmic contact on the NTC ceramics, and significantly strengthens the interfacial adhesion. In addition, the Ni layer ensures a high soldering quality, not only because it effectively prevents Ag from diffusing into bulk ceramics, but also because it has a high temperature corrosion-resistance in no-lead soldering.