不等厚复合构件相控阵超声脱粘检测技术仿真研究

Phased array ultrasonic debond testing of non-uniform thickness compound

鉴于不等厚复合构件结构的特殊性,采用传统超声检测技术检测此类构件的粘接质量是非常困难的。采用超声相控阵技术实现界面粘接质量的检测。分析研究了不等厚复合构件脱粘检测的特殊性。建立了相控阵超声换能器的辐射声场模型,基于仿真得到的声场,研究了采用超声相控阵技术检测不等厚复合构件界面脱粘的可行性。仿真结果表明,通过控制相控延时,可使检测声束在检测区域内聚焦到任意位置处,保证在厚度变化的界面处回波信号幅度的一致性,可用于此类构件的界面脱粘检测。

Due to the special structure, there is no effective testing method for adhesive interface of non-uniform thickness metal and nonmetallic compound components. The phased array ultrasonic detection technique using auto- focused mode can provide a new idea. This article describes the ultrasonic phased array technique to realize quality detection of interface bonding. The sound field of ultrasonic phased array transducer is established. Based on it, the possibility of using ultrasonic phased array method to detect component with non-uniform thickness is studied. The simulation results show that it is possible to control the radiation beam focused at every desired point by calculating the time delay. This can ensure the amplitude of reflected signal from the interface is almost same. The results indicate that the technique of applying phased array to ultrasonic detection can be used to detect the interface debond of non-uniform thickness metal and nonmetallic compound structure.