铜微沟道热沉精密加工技术研究

Copper Micro-channel Heat-sink Accurate Processing Technics Research

微沟道传热技术是当前国际传热领域研究的前沿,在大功率半导体激光器列阵、大型计算机芯片冷却等领域具有广泛的应用前景。为了克服有成熟加工技术的硅微沟道导热系数不高的缺陷,解决普通铜沟道机械加工技术中加工切向应力对沟道壁的破坏无法获得小于300μm的沟道壁以及机械加工后毛刺对制冷流体工质阻力极大的问题,对导热系数更高的铜微沟道的沟道加工工艺进行了研究。利用机械雕刻和化学腐蚀相结合的方法,获得一种简单的机械-化学二次加工工艺,实现了对铜微沟道的精密加工,满足微沟道壁薄、沟道光滑的技术要求,且价格便宜、制作工艺简单。

The micro-channel heat conduction was the leading edge of international transfer heat search field. There are good prospects cooling for high power diode laser array ＆ large computer CPU and so on. In order to overcome the drawback, poor material conductivity of silicon micro-channel in which processing technologies are well established, this paper has searched for a new processing technical to manufacture high conductivity copper micro-channel. The purpose was solving the problem that mechanical stress caused damage to the wall of micro-channel so that less than 3001xm channel could not be made in common machine and the burr by handling would block up the channel. We utilized union mechanical-sculpture ＆ chemical-etch method to obtain a simple machine-chemistry couple processing technique to make accurate copper micro-channel which satisfy the technical requirement of channel＇ s wall thin and smooth. Furthermore, the price is inexpensive, and manufacturing is easy.