摘要
为了改善SnAgCu系无铅钎料焊点的抗跌落性能,采用实验方法研究了SnAgCu钎料中银含量对焊点抗跌落性能的影响,并对实验结果进行了统计分析。结果表明,随着银含量的降低,在显著度为99%的条件下,钎焊接头的抗跌落性能显著提高。钎焊接头中存在缺口时,跌落次数明显下降。接头的破坏主要发生在钎料与铜基体之间的界面层上,破坏断口具有脆性断裂特征;界面层随着银含量的减小而逐渐减薄,这是导致钎焊接头抗跌落性能提高的主要原因。
In order to improve the drop property of SnAgCu lead-free solder joint, the effect of silver content on drop property of solder joint was investigated and the experimental results were analyzed by statistics method. Results show that with the decreasing of silver content in SnAgCu solder, under the significance testing at 99% probability, the drop property of solder joint can be improved significantly. The solder joint with a preset gap has a shorter drop lifetime. During drop test, failures occur at the interface layer between copper base metal and solder material for all solder joints. The brittle fracture characteristic exists in the appearance of failure position. It is found that the interface layer is getting thinner continuously with the decreasing of silver content, which might be the main cause to improve the drop property of solder joint.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第10期59-62,80,共5页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.51005004
No.51275006)
北京市自然科学基金资助项目(No.3132006)
北京市教委科研资助项目(面上)(No.KM2012100050010)
关键词
无铅钎料
焊点
抗跌落性能
银含量
界面层
表面组装技术
lead-free solder
solder joint
drop property
silver content
interface layer
surface mounted technology
