摘要
焊锡膏发干失效是生产中常遇到的问题之一。以焊锡膏在存放过程中印刷性能和焊接性能的变化为主要指标,研究了单一及复配溶剂对SnAgCu系焊锡膏储存稳定性的影响。结果表明:单一溶剂四氢糠醇、MPEG250、MPEG400均提高焊锡膏的储存稳定性,单一溶剂乙二醇甲醚和乙二醇乙醚均降低焊锡膏的储存稳定性。复配溶剂对提高焊锡膏储存稳定性存在增效作用,其中四氢糠醇与MPEG250以质量比8:2复配的焊锡膏在室温环境下储存14 d,四氢糠醇与MPEG400以8:2质量比复配的焊锡膏储存16 d以上,均保持良好的性能。
Dry paste failure is one of the common problems in production. In this study, the effects of single and compound solvents on the storage stability of SnAgCu solder paste were investigated with the printing and soldering performances changing during the storage process as main indexes. The results show that single solvent like tetrahydrofurfuryl alcohol,MPEG250,MPEG400 can improve the storage stability of solder paste, while ethylene glycol methyl ether and ethylene glycol ethyl ether reduce the storage stability of solder paste. Complex solvent contributes to improving the storage stability of solder pastes. Mixed with tetrahydrofurfuryl alcohol and MPEG250（mass ratio is 8：2） as solvent, the solder paste is stored for 14 days at room temperature, and mixed with tetrahydrofurfuryl alcohol and MPEG400（mass ratio is 8：2） as solvent, the solder paste is stored for 16 days at room temperature, these two both keep excellent performances.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第10期63-66,80,共5页
Electronic Components And Materials
基金
陕西省重点学科建设专项资金资助项目(No.00×902)
关键词
助焊剂
焊锡膏
有机溶剂
回流焊接
储存稳定性
室温密闭
flux
solder paste
organic solvent
reflow soldering
storage stability
closed room temperature
