摘要
随着集群计算广泛应用,更多异构系统整合重组、更多数据中心的建设以及多核技术的广泛应用,从而对服务器的要求越来越高。由此带来对PCB的工艺能力也随之不断提升,包括对材料、信号传输及更高可靠性方面。本文阐述高端服务器在PCB上的设计特征、信号传输要求带来的对PCB流程设计和工艺控制方法,以供业界同行参考。
With the wide application of cluster computing, more and more reorganization and consolidation of isomeric system, construction of data centre and wide application for multi-core technologies, it requires ever-higher levels of the servers. So it will bring higher requirement for PCB’s technologies capability, including material, signal transmission and higher reliability and so on. This article will elaborate the PCB’s design features for high-end sever, signal transmission requirement of PCB process design and control, for community fellow reference.
出处
《印制电路信息》
2014年第2期16-21,共6页
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