摘要
概述了在印制板中"离子迁移"(CAF)漏电的机理、危害和对策.明确提出PCB走向高密度化和信号传输高频化的条件下,"离子迁移"漏电将走向严重化,要求进行CAF的测试与管控的重要性.
The paper describes the mechanism ,harm and improvement of CAF in PCB. The seriousness of CAF is increasing under the condition of function of the high-density and high-frequency with transmission signal. The importance of test and control in CAF is required.
出处
《印制电路信息》
2014年第2期48-50,61,共4页
Printed Circuit Information
关键词
离子迁移
机理和条件
杂质和通道
湿气和电势
对策和改善
CAF
Mechanism and Condition
Impurity and Passage
Moisture and Potential
Countermeasure and Improvement
