摘要
针对防焊出现的显影不净问题,通过实际的生产跟进分析验证,找出造成显影不净的主要因素:无尘房的温湿度、油墨本身的性能、油墨在产线(开油到显影的停放时间)。为解决此类问题提供思路。
This paper made analysis to the defect of developing no net in solder mask process production and found the main reasons：the clean room temperature, solder mask performance, solder mask stay time in process and provided reference in solving similar issue.
出处
《印制电路信息》
2014年第2期55-56,共2页
Printed Circuit Information
关键词
阻焊剂
孔环
显影
Solder Mask
Ring of Hole
Developing
