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薄膜材料杨氏模量测量方法的研究进展 被引量:1

Research Progresses of Young's Modulus Measurement Method of Thin Film Materials
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摘要 基于国内外薄膜材料杨氏模量测试的最新研究进展,系统地综述了近年来薄膜材料杨氏模量的测量方法,包括共振法、纳米压痕法、动态膨胀法以及视觉图像跟踪系统与微拉伸复合法等,并对这些测试方法的基本原理、研究现状及存在的问题做了简要介绍。在这些方法中纳米压痕法和共振法是相对准确而且普及的测量方法。当薄膜厚度减小到纳米量级时,纳米压痕法将达到测试的极限。共振法对于器件的加工工艺有一定的依赖,但辅以其他相关纠正技术将来有望成为测试纳米级薄膜杨氏模量的标准方法。 Based on the latest research progresses of Young's modulus measurement of thin films at home and abroad,the measurement methods of Young's modulus of thin films are systematically summarized,including the resonance method,nanoindentation method,dynamic expansion method,visual image tracking system and micro tensile test method.The basic principle,research status and existing problems of these measurement methods are introduced briefly.Among these methods,the nanoindentation method and resonance method are relatively accurate and universal.When the film thickness decreases to the nanometer level,the nanoindentation method will reach the detection limit.To some extent,the resonance method is influenced by the fabrication process of devices,but it is expected to be the standard test method of Young's modulus in nanometer thin films in the future with some related correcting technologies.
出处 《微纳电子技术》 CAS 北大核心 2014年第10期659-665,共7页 Micronanoelectronic Technology
基金 国家自然科学基金资助项目(11004251) 北京市自然科学基金资助项目(4142047) 北京市高等学校"青年英才计划"资助项目
关键词 微机电系统(MEMS) 薄膜材料 微观结构 杨氏模量 共振法 纳米压痕法 micro electro-mechanical system(MEMS) thin film material microstructure Young's modulus resonance method nanoindentation method
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参考文献31

  • 1NATHANSON H C, WICKSTROM R A. A resonant-gate silicon surface transistor with high-O band-pass properties[J]. Applied Physics Letters, 1965, 7 (4): 84-86.
  • 2NEWEI.L W E. Miniaturization of tuning forks [J]. Science, 1968, 161 (3848): 1320- 1326.
  • 3HARDWICK D A. The mechanical propertites of thin films: a review [J]. Thin Solid Films, 1987, 154 (1/2): 109- 124.
  • 4FATIMA VALES SILVA M, HANCOCK P, NICHOLLS J R. An improved three-point bending method by nanoidentation [J]. Surface and Coatings Technology, 2003, 169/170: 748 - 752.
  • 5顾利忠,苏菲,赵颉,张以恒.静电激振法测量微机械材料的杨氏模量[J].材料科学与工程,2001,19(2):9-11. 被引量:3
  • 6PETERSEN K E, GUARNIERI C R. Young's modulus mea- surements of thin films using micromechanics [J]. Journal of Applied Physics, 1979, 50 (11): 6761-6766.
  • 7BAEK C W, KIM Y K, AHN Y, et al. Measurement of the mechanical properties of electroplated gold thin films using mi- cromachined beam structures [J].Sensors and Actuators: A, 2005, 117 (1): 17-27.
  • 8GOTO D, NAMAZU T, INOUE S, et al. Young's modulus measurement method for nano-scale film materials by using MEMS resonator array [C] // Proceedings of Solid-State Sensors, Actuators and Microsystems Conference. Denver, USA, 2009: 1321-1324.
  • 9BENOIT C, SALVADOR M, FABIEN P, et al. Generation of electrically induced stimuli for MEMS self-test [J]. Journal of Electronic Testing, 2001, 17 (6) : 459 - 470.
  • 10REHDER G, CARRENO M N P. PECVD a-SiC : H Young's modulus obtained by MEMS resonant frequency [J]. Journal of Non-Crystalline Solids, 2008, 354 (19/20/21/22/23/24/ 25), 2359 - 2364.

二级参考文献5

  • 1王渭源 谭淞丰 等.微电子机械基础技术及其应用[J].微米纳米科学与技术,1995,1:15-22.
  • 2[1]Sastry S.S, Cohn M, Tendick F. Mini-robotics for remote,minimally invasive surgery[J].Robotics and Autonomous Systems, 1997,21: 305~316
  • 3[2]Jaccodine R J, Schlegel. W. A. Measurement of Strains at Si-SiO2 Interface[J].J Appl Phys, 1966,37 (6): 2429~2434
  • 4[3]Petersen K E, Guarmieri C R. Young' s modulus measurements of thin films using micromechenics [J]. J Appl Phys,1979,50(11) :6761~6766
  • 5顾利忠,蔡庆胜,胡轶.光激励微型悬臂梁谐振器[J].应用激光,1991,11(5):214-216. 被引量:4

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