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三结砷化镓太阳电池干法刻蚀技术研究 被引量:3

Isolated Grooves Etching on 3J GaAs Solar Cell by ICP
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摘要 通过采用Cl2/BCl3/Ar作为刻蚀气体对三结砷化镓太阳电池隔离槽干法刻蚀工艺进行研究。针对单参数对刻蚀速率及刻蚀形貌的研究,摸索出最优工艺参数。研究结果表明采用合适的工艺参数,可以实现隔离槽一次刻蚀,并且干法刻蚀技术制备的二极管电性能良好,能经受环境适应性试验和可靠性验证。利用干法刻蚀技术,刻蚀精度大为提高,刻蚀形貌也大为改善,二极管制备合格率提高了2.5%以上。 The process of dry etch isolated grooves by Cl2/BCl3/Ar gas was researched for triple-junctions GaAs solar cell.With the study of the influence of the etch velocity and appearance with single parameter,the optimum condition was obtained.The result shows that the isolated groove can be etched completely with one etch condition,the diodes prepared with dry etch method have a good electrical characteristic.Using dry etch method,the etch precision and the etch appearance was improved greatly,the qualification rate of the diodes increased above 2.5 percent.
出处 《贵州大学学报(自然科学版)》 2014年第4期52-56,共5页 Journal of Guizhou University:Natural Sciences
基金 上海自然科学基金项目(13ZR1457800 12170700500)
关键词 砷化镓 太阳电池 旁路二极管 干法刻蚀 GaAs solar cell bypass diode dry etch
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  • 1[1]Daga O P, Fricke K, Hartnagel H L. Improved Via Hole Etching for Source Grounding of Microwave MESFET[J].Journal of the Electrochemical Society, 1986, 133 (12):2660 ~ 2661.
  • 2[2]Deligeorgis G, Lagadas M, Constantinidi G. Improvement of uniformity in conventional RIE process for via hole fabrication in GaAs based MMICs [HEMTs] [A]. Semiconductor Conference[C]. 2000, 1(10 - 14): 163 ~ 166.
  • 3[3]Sumitani K, Komaru M, Kobiki M, et al. A high aspect ratio via hole dry etching technology for high power GaAs MESFET[A]. GaAs IC Symposium[C]. 1989, 22~25.
  • 4[4]Chung M S, Kim H R, Lee J E, et al. Via hole process for GaAs monolithic mirowave integrated circuit using two - step dry etching[J]. Journal of Vacuum Sci& Technol B,1993, 11(2): 159 ~ 162.
  • 5[5]Salimian S, Cooper C B, Day M E. Dry etching of via connections for GaAs monolithic microwave integrated circuits fabrication[J]. Journal of Vacuum Sci & Technol B, 1987, 5(6): 1606~1610.
  • 6[6]Henry Hendriks, Jim Crites, Gerald D'Urso, et al.Challenge in Rapidly Scaling up Backside Processing of GaAs Wafers[A]. GaAs Mantech Conference[C]. 2001.
  • 7[7]Berg E W, Pang S W. Low -pressure etching of nanostructures and via holes using an inductively coupled plasma system[J]. Journal of the Electrochemical Society,1999, 146(2): 775 ~ 779.
  • 8[1]Takahashi Ken, et al. Characteristics of GaAs solar cells on Ge substrate with a preliminary grown thin layer of AlGaAs [J]. Solar Energy Materials and Solar Cells, 1998, 50: 169.
  • 9[2]Chang K I, Yeh Y CM, Iles P A, et al. Heterostructure GaAs/Ge Solar Cells [A]. Proceedings of the 19th Photovoltoic Specialists Conference (IEEE, NY, 1987) [C]. 1987. 273.
  • 10[3]Wojtczuk S, Tobin S, Sanfacon M, et al. Monolithic two-terminal GaAs/Ge Tandem space concentration cells [A]. Proc. 22nd PVSC [C], 1991. 73.

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