摘要
采用循环伏安法(CV)测试,结合量子化学计算和扫描电子显微镜(SEM)分析,研究了配位剂丁二酰亚胺对银电沉积过程的影响。结果表明:Ag+与丁二酰亚胺配位后,还原电位负移。不同丁二酰亚胺浓度和pH值条件下,丁二酰亚胺与Ag+形成的配合物形式以及配合物稳定性均不同。随着丁二酰亚胺浓度增大以及pH值升高,形成的配合物也更稳定。当pH为10时,丁二酰亚胺与Ag+能够形成稳定的配合物[Ag(C4H4NO2)2]-、[Ag(C4H4NO2)3]2-和[Ag2(C4H4NO2)4]2-。在适宜的电位范围内能够制备出结构致密、表面平整的银镀层。
Effects of succinimide on the electrochemical reduction process of Ag^+in solution were investigated by cyclic voltammetry(CV),quantum chemical calculation and scanning electron microscope(SEM).The results show that reduction potential of Ag^+negatively shifts with the addition of complexing agent.Variation of the solution pH and complexing agent concentration affects the complex forms and stability.The compound complexed by succinimide and Ag^+is more stable when the complexing agent concentration and pH is higher.Ag^+are reduced as the form of[Ag(C4H4NO2)2]^-,[Ag(C4H4NO2)3]^2-and[Ag2(C4H4NO2)4]^2-that are stable in the succinimide solution when pH is 10.The coating obtained under the optimum conditions is compact smooth.
出处
《中国表面工程》
EI
CAS
CSCD
北大核心
2014年第5期39-44,共6页
China Surface Engineering
基金
国家重点基础研究发展计划(973计划)(2013CB632500)