摘要
提出了一种自散热片式LED-COB光源结构。将LED芯片放置在6061铝合金基板侧面,该侧面加工有光学反光槽。整个基板既作为LED芯片的支架,又作为散热片。LED芯片与外界环境之间只有固晶胶一层热阻,大大提高了LED散热系统的散热效率。所设计的COB光源的功率为1~2 W、散热面积为30 cm2、质量为1.9 g。经过测试,在环境温度为25℃、功率1.92 W、发光面处于顶部的竖直放置的条件下,红外热像仪测得散热片上的最高温度为66.2℃,通过正向电压法测得LED芯片的结温为72.4℃。自散热片式COB-LED光源不仅能提高LED灯具的散热性能,同时还能降低LED灯具的系统成本。
A novel Self-Cooling LED-COB lighting source has been proposed. The LED chips were packaged on the one side of 6061 aluminum alloy substrate which has been processed with reflector. With this package structure, the only thermal resistance between the LED chip and the ambient is chip bonding material, so this package structure improves the cooling efficiency of the LED cooling system. The Self-Cooling LED-COB lighting source we designed is about 1~2 W, the radiating area is 30 cm2, the weight of the fin is 1.9 g. According to the test, under the condition of 25 ℃, the power is 1.92 W,the highest temperature on the fin is 66.2℃, by the forward voltage method, we calculated the LED chip temperature is 72.4℃. Self-Cooling COB-LED lighting source not only improves the thermal dissipation performance of LED lamps, but also reducing the cost of LED lighting systems.
出处
《电子工艺技术》
2014年第5期249-252,291,共5页
Electronics Process Technology
基金
广东省科技创新资金项目(项目编号:2012CY142)
关键词
自散热
COB光源
热分析
封装结构
散热性能
Self-radiating
LED-COB light source
Thermal simulation
Package structure
Thermal dissipation performance