摘要
为了研究光纤端面的现行加工工艺,提出了一种光纤端面材料去除的分析方法。对被加工光纤端面和研抛工具先进行研磨压力的有限元分析,再模拟计算光纤研磨速度,最后分析去除率的材料。结果表明:光纤端面材料去除率的变化周期主要受研磨速度影响;成形初期的研磨去除率分布主要受研磨压力的影响;与平动式光纤研磨机相比,用行星回转式光纤研磨机加工一批单芯光纤和MPO多芯光纤插头时,由研磨速度的差异引起的各纤芯间材料去除率变化的最大值分别为3%和0.32%。本模拟分析方法建模简单,直观,模拟分析结果与生产现状相一致。
In order to investigate the existing process of optical fiber end-face, a simple material removal analysis on optical fiber end-face is established .Analyzing the fiber and lapping/polishing film posted on the rubber pad as follow,first the FEM static analysis of lapping pressure, secandly, simulating lapping/polishing velocity, at last analyze the material removal rate on basis of 1＆amp;2. Analysis results indicate that the material removal rate varied periodically with time, as like the lapping/polishing velocities, the distributions of material removal rate at beginning of the forming processing mainly affected by the lapping pressure;Using planetary rotary fiber lapper, not translational one,the Max. R/t among of single fiber end-faces is 3%,because of different lapping velocity and this value will up to 3%for the MPO end-face. This analysis is easy to model,and simulation results are corresponding to the processing.
出处
《机电工程技术》
2014年第9期77-80,137,共5页
Mechanical & Electrical Engineering Technology
基金
天津市自然科学基金面上项目(编号:13JCYBJC18100)
天津职业大学培育项目(编号:20101101)
关键词
材料去除
光纤端面
研磨/抛光
material removal
optical fiber end-face
lapping/polishing
