大孔径和田玉超声波振动深孔钻削系统设计

Design for Large Aperture Hetian Jade Ultrasonic Vibration Deep-hole Drilling System

根据和田玉材料高硬度、高韧性的特点,设计一种大孔径内排屑超声波振动深孔钻削系统。重点介绍了加工系统主要部件钻头、振动系统的设计。研究了大孔径、内排屑方式超声波深孔振动钻削理论,为后期研究和田玉超声波深孔加工机制及其裂纹预防策略提供了理论依据。

According to the Hetian jade characteristics of high hardness and high toughness,a large aperture inside chip removal ultrasonic vibration deep-hole drilling system was designed. Key parts of drilling head and vibration system were introduced mainly. The theory was researched for large aperture,inside chip removal method ultrasonic vibration deep-hole drilling. It provides theoretical basis for research in later stage of Hetian jade ultrasonic deep-hole processing mechanism and cleft preventive strategy.