封闭机箱冷却流场的热优化设计

Thermal Optimized Design of the Cooling Flow Field for Enclosed Chassis

机箱的散热能力不仅会影响计算机的计算速度,也会影响各元器件的使用寿命。为了提高计算机封闭机箱的散热能力,依据湍流理论,建立了机箱冷却流场数学模型,并采用Icepak电子热设计专用软件对排风和进风方式进行了仿真优化。通过分析比较封闭机箱内电子元器件的温度、热流速度曲线、风流动轨迹图,获得了较为理想的温度场的冷却方式。优化结果表明,该优化方案实用、简单、准确,机箱散热效果好,为电子产品热设计提供了一个较为理想的热分析方法。

The heat dissipation capability of the chassis not only affects the operation speed of the computer, but also affects the life cycle ofvarious components. In order to improve the heat dissipation capability of the enclosed chassis, based on turbulence theory the mathematicalmodel of cooling flow field of the chassis is established. In addition, the simulation optimization is conducted for exhaust and air intake mode byadopting Icepak dedicated electronics thermal design software. Through analyzing and comparing the temperature, heat flux curve, airtlowtrajectory of electronic components inside chassis, the ideal cooling mode for temperature field is obtained. The result of optimization shows thatthis strategy is practicable, simple, and accurate for heat dissipation of the chassis. It provides ideal thermal analysis method for thermal designof electronic products.