摘要
本文主要是用温度光弹性法,通过模型试验来研究半刚性基层沥青路面的温度应力状态和路面结构的开裂机理.研究结果表明,温度应力是引起路面开裂的主要原因.文中还较详细地分析了路面开裂后,裂纹扩展规律和裂纹稳定性问题.
This paper presents the study of the temperature stress state and the mechanism of cracking of asphalt pavement on semi -rigid base by means of photaelastic model. The test results in this paper show that the temperature stress is the main cause of cracking in the pavement structure. The law of crack development and the steadiness of crack are also analyzed in the paper.
出处
《中国公路学报》
EI
CAS
CSCD
北大核心
1991年第4期20-28,共9页
China Journal of Highway and Transport
基金
"七五"国家重点科技攻关项目75-24-01-01子报告-14
关键词
沥青路面
温度梯度
光弹性
道路
Temperature gradient Cracking Semi rigid base Photoelastic method
