摘要
高低温循环可以加速暴露出密封半导体器件中的可动多余物。为了提取多余物,改进了传统开洞PIND法。第一,通过对大量的金属封装进行开孔试验,得出最佳盲孔厚度为25～30 μm的重要工艺参数,为指导金属封装多余物的提取提供量化依据;第二,在开孔工艺中用三棱锥针取代传统的圆锥针,减少了因开孔产生多个卷边易产生封帽碎屑的风险;第三,采用有色有机溶剂对封帽局部染色的工艺标识封帽碎屑,改善传统方法中难以区分外引入物和内多余物的缺陷。介绍了将3种新工艺应用于一种微波功率管的案例,成功地提取出金锡焊料多余物,整改工艺缺陷后PIND第一次失效率得到大幅的降低,论证了开洞PIND法是一种提取腔体半导体器件多余物的科学、可靠的技术方法,其改进工艺还在不断地涌现。
High-low temperature cycle is capable of faster exposing the reminders form sealed devices. On the basis of a classical PIND boring method, three novel processes are introduced in order to capture reminders. Firstly, a hole-opening test of metal package is repeated frequently to obtain the optimal depth of blind hole, which is 25μm-30μm. Secondly, a category of needle with a triangular-pyramid replaces the traditional one with circular cone, which decreases the risk of production of metal curls. Thirdly, a colored organic solution is to mark a local area of cap, which corrects the defect of being unable to comfortably distinguish outside particles and inner reminders of the classical method. The three methods are adopted into a batch of microwave power transistors, and the energy spectrum indicates an existence of gold-tin solder. Posterior to the enhancement of process, the first failure rate of PIND has fallen greatly. Above all, a PIND boring method is indeed a scientific and valid process of capturing reminds of sealed devices and some new improved methods surge more and more rapidly.
出处
《电子产品可靠性与环境试验》
2014年第5期26-31,共6页
Electronic Product Reliability and Environmental Testing
