摘要
发光二极管(LED)作为第四代照明光源,其发光性能不但和电学特性相关,还受pn结结温的影响。LED的发光效率随着结温的升高而降低,LED的使用寿命也会随之减小。因此对LED结温进行准确检测具有重要的意义。利用Fluke Ti20红外测温摄像仪和ANSYS有限元软件模拟仿真结合的方法来分析LED模块的结温,并与标准电压法测得的结温进行对比。利用该方法获得的仿真结果与电压法实测LED结温值误差小于2%,与红外测温仪实测结果相差不超过5%。实验证实该方法可以作为LED非接触式结温分析的一种有效的工程方法。
Light emitting diode （LED）, as the fourth generation of luminous energy, whose lumi- nescent properties are related to the electrical properties, and affected by the p-n junction tempera- ture. LED luminous efficiency decreases as the junction temperature increases, and the service life is also reduced. Therefore, the LED junction temperature detection is of important significance. The junction tem- perature was detected through the method of ANSYS software simulation combined with Fluke Ti20 infra- red camera. Then compared the result of this method with the result of standard voltage method, the error between the simulation result and the voltage experimental result is less than 2%, the error between simu- lation result and infrared camera experimental result is less than 5%. This confirmed that the method of ANSYS finite element simulation combined with infrared camera can be used as an effective non-contact engineering approach of LED junction temperature analysis.
出处
《半导体技术》
CAS
CSCD
北大核心
2014年第11期872-877,共6页
Semiconductor Technology
基金
浙江省自然科学基金资助项目(Q12F050002)
关键词
发光二极管
结温
ANSYS
红外摄像
电压法
light emitting diode （LED）
junction temperature
ANSYS
infrared camera
voltage method
