摘要
铜柱互连技术被越来越多地应用于电子器件的先进封装中,铜柱互连技术已成为倒装芯片封装的主流。综述了该技术的发展历程并对铜柱互连技术的重要专利进行较详细的分析,给出了该技术的发展脉络及未来可能的发展方向,为后续的研究提供参考。
Cu pillar bump technology is increasingly applied in advanced IC packages. Cu pillar bump technology becomes mainstream technology for the flip chip assembly technologies. The development course about Cu pillar bump technology is reviewed and important patents about this technology are analyzed in detail. The development course and future possible development direction about this technology are obtained to hope establishing a base for follow-up studies.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第11期10-13,共4页
Electronic Components And Materials
关键词
铜柱
电子封装
综述
互连
专利
专利分析
Cu pillar
electronic package
review
interconnect
patent
patent analysis
