摘要
研究了焊膏材料特性、针头外形、点涂高度、滞留时间、回复高度、环境温度、针管内液面高度等对焊膏点涂工艺的影响。结果表明:影响焊膏可点涂性的材料特性主要包括焊球粒度、焊膏黏度和合金体积比;在点涂针头的选择上,尖锥形针头比常规直壁针管的针头更优;点涂高度对点涂焊膏量、点涂焊膏点的形貌、高度和直径均有显著影响,其中点涂焊膏量随点涂高度的增加而增加,变化过程可分为完全堵塞阶段、快速增长阶段和相对稳定阶段;此外,回复高度、环境温度、针管内液面高度均对焊膏点涂有显著影响,而滞留时间对焊膏点涂的影响不明显。
The effects of solder paste properties, nozzle shape, dispensing height, delay time, retracting height, ambient temperature and the level of material in the syringe on solder paste dispensing process were investigated. The results show that the material properties affecting the dispensability of solder paste include solder powder size, solder paste viscosity and the volume fraction of alloy. As for dispensing nozzle, the conical nozzle is better than the conventional straight-walled tip nozzle. The dispensing height has significant influence on dispensing mass, deposit shape, deposit height and deposit diameter, where the dispensing mass increases with increasing dispensing height, and the growth process can be divided into three stages： completely clogged stage, rapidly rising stage and relative steady stage. In addition, retracting height,ambient temperature and the level of material in the syringe all have significant influence on solder paste dispensing,whereas delay time do not influence solder paste dispensing significantly.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第11期99-103,共5页
Electronic Components And Materials
关键词
钎焊
点涂
焊膏
工艺稳定性
影响因素分析
材料特性
soldering
dispensing
solder paste
process stability
influential factor analysis
material properties
