基于EDEM的带槽弹体排屑性能的数值模拟与分析

Nmuerical Simulation and Analysis Chips Discharging Performance of Projectile with Groove Based on EDEM

为了分析弹槽形状对弹体排屑性能的影响,通过离散元软件EDEM对无槽弹体、直槽弹体及螺旋槽弹体的排屑过程进行数值模拟。排屑能力由好到坏依次为直槽弹体、螺旋槽弹体及无槽弹体。另外,研究了带直槽个数与排屑性能的关系。结果表明:随着槽数的增加,相应的排屑性能逐渐变好。最后,试验验证了数值模拟的可行性和正确性。相关结果可为新型侵彻弹丸的设计提供参考。

In order to analyse the influence of chips discharging performance of projectile for groove shape, the process of chips discharging for slotless projectile, straight and spiral groove projectile was simulated by discrete element software EDEM. The chips discharging ability from good to bad is straight groove projectile, spiral groove projectile and slotless projectile. In addition, the relationship between straight groove number and chips discharging performance was studied, the results show that with the increase of the groove number, the corresponding chips discharging performance gradually get better. Finally, experiment proved the correctness and feasibility of the numerical simulation. The research results could provide the reference for the design of the new penetration projectile.