期刊文献+

金锡共晶合金凝固研究进展(英文) 被引量:3

Research Progresses on the Modification of Solidification Structure of Au-Sn Eutectic Alloy
下载PDF
导出
摘要 金锡二元共晶合金钎料是一种广泛应用于高可靠微电子与光电子器件封装中的连接材料,目前我国对该类高性能钎料的凝固与成形控制缺乏深入系统地研究。合金铸态组织粗大和硬脆性金属间化合物的不均匀分布是导致合金加工成形困难的根本原因,铸态组织细化将显著提高合金的加工成形性能。综述了合金的快速凝固、熔体温度处理、孕育形核处理和熔体混合处理等对金锡共晶合金凝固组织细化及组织演变规律影响等方面的研究进展。 Au-20Sn eutectic alloy solder is extensively used in high power electronics and optoelectronics packaging. The heterogeneous distribution of primary phase and coarse structure are contributed to the difficulty of the process. Therefore, refining the solidification structure becomes extremely important. The research progresses on the refinement of Au-Sn eutectic alloy solidification structure, such as the effects of composition micro-adjustment and melt temperature treatment on the solidification microstructure, effects of incubated nucleation treatment on the refinement of solidification structure, modification of the solidification microstructure by melt mixing are summarized.
出处 《贵金属》 CAS CSCD 北大核心 2014年第A01期108-114,共7页 Precious Metals
基金 National Natural Science Foundation of China(50964014,51161024)
关键词 金锡共晶合金 快速凝固 熔体温度处理 自孕育形核 熔体混合处理 Au-Sn eutectic alloy rapid solidification melt temperature treatment incubated nucleation melt mixing
  • 相关文献

参考文献19

  • 1Oppermann H. Materials for Information Technology-The Role of Au/Sn Solder in Packaging[M]. London: Springer, 2005: 377-390.
  • 2刘泽光,陈登权,罗锡明,许昆.金锡钎料性能及应用[J].电子与封装,2004,4(2):24-26. 被引量:16
  • 3Chung S M, Chen C M, Lin C P, et al. Microstructural evolution of the Au-20wt.%Sn solder on the Cu substrate during reflow[J]. Alloys Compd, 2009, 485(1/2): 219-224.
  • 4Tsai J Y, Chang C W, Shieh Y C, et al. Controlling the microstructure from the gold-tin reaction[J]. Electron Mater, 2005, 34(2): 182-187.
  • 5Zhang G S, Jing H , Xu L Y, et al. Creep behavior of eutectic 80Au/20Sn solder alloy[J]. Alloys Compd, 2009, 479(1/2): 138-141.
  • 6Tan Q, Deng C, Mao Y, et al. Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification path- ways[J]. Gold Bulletin, 2011, 44(1): 27-36.
  • 7Kruz W, Fisher D J, Li J C et al. Fundamentals of Solidifiation[M]. Beijing: High Education Press, 2009.
  • 8Xu C L, Jiang Q C. Morphologies of primary silicon in hypereutectic A1-Si alloys with melt overheating temperature and cooling rate[J]. Mater Sci Eng, 2006, A437(2): 451-455.
  • 9Xu C L, Wang H Y, Qiu F, et al. Cooling rate and microstructure of rapidly solidied A1-20wt.%Si alloy[J]. Mater Sci Eng, 2006, A417: 275-280.
  • 10何树先,王俊,孙宝德,周尧和.熔体温度处理细化亚共晶Al-Si合金组织[J].上海交通大学学报,2002,36(1):51-54. 被引量:10

二级参考文献38

  • 1刘泽光,陈登权,罗锡明,许昆.微电子封装用金锡合金钎料[J].贵金属,2005,26(1):62-65. 被引量:37
  • 2王广厚.团簇物理的新进展(Ⅰ)[J].物理学进展,1994,14(2):121-172. 被引量:101
  • 3刘泽光,陈登权,许昆,罗锡明,陈亮维.D-KH法制备金锡合金的组织与结构[J].贵金属,2005,26(3):30-33. 被引量:15
  • 4陈亚军,许庆彦,黄天佑.铝合金晶粒细化剂研究进展[J].材料导报,2006,20(12):57-61. 被引量:40
  • 5Ohmi T, Kudoh M. Effect of casting condition on re- finement of primary crystals in hypereutectic Al-Si alloy ingots produced by duplex casting process [ J]. J. Japan Inst. Metals, 1992, 56: 1064.
  • 6Ohmi T, Kudoh M. Formation of fine primary silicon crystals by mixing of semi-solid slurry of hypoeutectic Al- Si alloy and phosphorous-added hypereutectic Al-Si alloy melt [J]. J. Japan Inst. Metals, 1994, 58: 324.
  • 7Ohmi T, Iguchi M. Solidification structure and hard- ness distribution in centrifugally cast aluminum alloy du- plex pipes [ J]. Materials Science Forum Vols, 2010, 631(632) : 367.
  • 8Yang C L, Liu F, Yang G C, Chen Y Z, Liu N, Li J S, Zhou Y H. Non-equilibrium transformation in hyper- cooled Fe83B17 alloy [ J]. Materials Science and Engi- neering: A, 2007, 458(1-2) : 1.
  • 9Herlach D M. Non-equilibrium solidification of under- cooled metallic melts [ J]. Material Science and Engi- neering R: Reports. 1994, 12(4-5): 177.
  • 10Ciulik J, Noris M R. The Au-Sn phase diagrams [ J ]. J. Alloys Compd. , 1993, 191: 71.

共引文献39

同被引文献18

引证文献3

二级引证文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部