摘要
由于IP芯核被嵌入到片上系统(SoC)后,无法直接对其输入输出引脚进行测试,传统的测试方法已不能满足IP核的测试需求。在对IEEE 1500标准进行相关研究的基础上,分析了测试架构的结构功能及其相应的操作指令,对ITC’02基准测试电路中的h953芯片进行了外壳测试封装设计,并通过多种指令仿真验证了设计的正确性。
After IP cores being embedded in the SoC, there is a big problem for SoC test that the input and output terminals of the IP cores can not be tested directly, while the traditional test methods can not meet the needs of IP cores. On the basis of the relevant study on IEEE Std 1500, the structure and function of the test framework are analysised as well as the corresponding instructions. A test wrapper based on IEEE 1500 will be designed for b953 which is one of the ITC＇ 02 benchmark circuits and a variety of simulation instructions are used to prove the validitiy of the design.
出处
《微电子学》
CAS
CSCD
北大核心
2014年第5期683-686,共4页
Microelectronics
基金
国家自然科学基金资助项目(61179001)
