摘要
采用化学镀铜工艺对SiC粉体进行了表面改性处理,然后烧结制备了α-SiCp/Cu复合材料,研究了SiC粉体含量对α-SiCp/Cu复合材料微观组织与硬度的影响。结果表明,通过化学镀铜工艺可实现SiC粉体的均匀包覆。随着SiC颗粒含量的增加,α-SiCp/Cu复合材料硬度和表面结合能力升高。
TThe surface of SiC powder was modified by electroless copper plating process, and then the composite α-SiCp/Cu was sintered, and the effect of the content of SiC powder on the microstructure and hardness of the composite was investigated. The results show that the uniform cladding of the SiC powder can be realized by the electroless copper plating. And the hardness and surface combining capacity of the composite are enhanced with the increase of the content of the SiC powder.
出处
《铸造技术》
CAS
北大核心
2014年第10期2214-2216,共3页
Foundry Technology
