一种热量约束下的3D-ICs调度测试划分方法

A Scheduling Test Partitioning Method under Thermally Constrained for 3D Integrated Circuits

提出了一种热量约束下的3D-ICs(三维堆叠集成电路)调度测试划分方法,该方法在充分考虑分区条件和不违反温度约束的条件下将每个测试按照原来测试的温度进行划分,允许与更多的测试并行执行,实现测试间的最大重叠。在ITC’02基准电路的实验结果表明,在温度有显著影响的环境中,与传统的方法比较该划分方法对调度质量有实质性的改进,利用测试时间的重叠可以有效地减少测试应用时间,降低测试成本。

A Scheduling Test Partitioning Method under Thermally Constrained for 3D stacked Integrated Cir- cuits was presented. The method considering the partition conditions and does not violate temperature constraints of each test are divided according to the original test temperature, allowing more tests parallel execution, to achieve the maximum overlap between tests. The experimental results on the ITC＇ 02 benchmark circuits show that, in envi- ronments where temperature has a significant impact, the partitioning method can improvement the scheduling quali- ty, can effectively reduce the test application time and the test cost, compared with the traditional method.