摘要
芯片叠层封装能够大幅提高集成度,硅通孔技术是集成电路三维封装的发展方向。但是随着封装密度增加功率密度增大,对散热的要求也愈加迫切。对芯片散热的最新进展进行了介绍,着重研究了微管液体冷却技术,在讨论了相关模型的基础上,对微管的制备方法进行了分析。
The emerging through silicon via （TSV） technology enables 3D stacking of ICs, which helps to continue miniaturizing integrated system and increasing functionality. Effective thermal cooling for high power density 3D stacked ICs is a crucial bottleneck. In order to mitigate the thermal challenge in high power 3D integration system, emerging new technologies are presented. Micro-channel fluidic cooling and air convection boundary condition is discussed. A novel chip-scale micro-channel fluidic cooling scheme is introduced.
出处
《中国电子科学研究院学报》
2014年第5期475-479,485,共6页
Journal of China Academy of Electronics and Information Technology
基金
国家自然科学基金(51302030)
关键词
硅通孔技术
热管理
微管液体冷却
TSV
thermal management
micro-channel fluidic cooling
