用于金属基板的高导热绝缘介质胶膜的研制

Preparation of Insulating Dielectric Film with High Thermal Conductivity for Metal Substrate

针对流延法制备高导热绝缘介质胶膜时溶剂无法完全挥发而影响金属基板性能的缺点,以环氧树脂为基体树脂,添加无机填料、固化剂和固化促进剂、丙烯酸树脂和光引发剂等,经紫外光固化后制得用于金属基板的高导热绝缘介质胶膜,并对其成膜性、导热系数、击穿电压、耐阻焊性和剥离强度等影响因素进行分析。结果表明:制备的高导热绝缘介质胶膜适用期长,导热系数达到2.123 W/(m·K),剥离强度为1.4 N/mm,耐浸焊时间大于300 s。

In view of the disadvantage that the solvent cannot completely volatilize in preparation of insulatingdielectric film by flow casting method and then influence the properties of metal substrate, usingepoxy resin as matrix resin, and adding inorganic filler, curing agent, curing catalyst, acrylic resin,photo-initiator to the epoxy resin, we prepared a insulating dielectric film with high thermal conductivityby UV-curing for metal substrate. The factors of influencing film forming, thermal conductivity, breakdownvoltage, soldering resistance, and peel strength were studied. The results show that the preparedinsulating dielectric film with high thermal conductivity has long pot life, and its thermal conductivity is2W/（m·K）, the peel strength is 1.4 N/mm, and the soldering resistance time is more than 300 s.