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Interfacial Characteristic of as-Deformed SiCp-Reinforced Magnesium Matrix Composite 被引量:2

Interfacial Characteristic of as-Deformed SiCp-Reinforced Magnesium Matrix Composite
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摘要 The (submicron + micron) SiCp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between SiCp and Mg in the composite was investigated by transmission electron microscopy. Results show that the interfacial characterization was different at the interfaces of micron-SiCp/Mg and submicron-SiCp/Mg. While most interfaces between micron-SiCp and Mg were clean, the precip- itated Mg17A112 phase as well as dispersedly distributed nano-MgO particles was observed at some interfaces. Unlike the interface between micron-SiCp and Mg, no interfacial reaction product was found at the interface between submicron-SiCp and Mg in the present study. Besides, the specific orientation relationships were found at the interfaces between submicron- SiCp and Mg, which was thought to have developed during hot deformation process. At the fracture surface of the composite, the microcracks were found at the interface between micron-SiCp and Mg, while the interfacial bonding between submicron-SiCp and Mg was very well. The (submicron + micron) SiCp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between SiCp and Mg in the composite was investigated by transmission electron microscopy. Results show that the interfacial characterization was different at the interfaces of micron-SiCp/Mg and submicron-SiCp/Mg. While most interfaces between micron-SiCp and Mg were clean, the precip- itated Mg17A112 phase as well as dispersedly distributed nano-MgO particles was observed at some interfaces. Unlike the interface between micron-SiCp and Mg, no interfacial reaction product was found at the interface between submicron-SiCp and Mg in the present study. Besides, the specific orientation relationships were found at the interfaces between submicron- SiCp and Mg, which was thought to have developed during hot deformation process. At the fracture surface of the composite, the microcracks were found at the interface between micron-SiCp and Mg, while the interfacial bonding between submicron-SiCp and Mg was very well.
出处 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2014年第5期885-893,共9页 金属学报(英文版)
基金 financially supported by the National Natural Science Foundation of China (Nos.51201112,51101043,and 51174143) the Natural Science Foundation of Shanxi province (No.2013021013-3)
关键词 Magnesium matrix composite SiC particles INTERFACES TEM Magnesium matrix composite SiC particles Interfaces TEM
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