期刊文献+

浅述射频微波集成电路在片去嵌技术

Introduction to RF and Microwave IC On-Wafer De-Embedding Technique
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摘要 本文介绍了用于射频微波集成电路在片测试的去嵌技术,包括开路去嵌法、开路短路去嵌法以及焊盘开路短路去嵌法,比较了常用的开路去嵌法和开路短路去嵌法的去嵌结果以及两种去嵌方法的适用范围。 The de-embedding techniques for RF and microwave integrated circuits on-wafer measurement, Open De-Embedding Method, Open-Short De-Embedding Method and Pad-Open-Short De-Embedding Method, are introduced in the paper. The de-embedding results and scope of application of Open De-Embedding Method and Open-Short De-Embedding Method are compared.
出处 《科技视界》 2014年第33期36-37,共2页 Science & Technology Vision
基金 江苏省海洋资源开发研究院开放课题(JSIMR201337) 淮海工学院繁荣计划(Z2012109)
关键词 在片测试 测试结构 开路短路去嵌 On-wafer measurement Test structure Open-Short De-Embedding
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参考文献4

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