印制电路板电镀铜颗粒缺陷的成因分析

Analysis on formation causes of copper particle defect on copper-plated printed circuit board

针对某印制电路板(PCB)全板电镀后出现呈规律分布的铜颗粒缺陷进行原因分析。从PCB化学沉铜和酸铜电镀两方面分析了铜颗粒的影响因素,结合PCB板镀铜的工艺流程进行对比试验,得出铜颗粒产生的主要原因,探讨了铜颗粒的产生机理,并提出了相应的预防措施。

The reasons for distributed copper particles the defect that some regularly exist on printed circuit board （PCB） after whole-board plating were analyzed. The influencing factors of copper particles were analyzed from the two aspects of electroless copper plating and acid copper plating of PCB. The main causes for the formation of copper particles were found by carrying out contrast experiments based on the process flow of copper plating of PCB. The mechanism for generation of copper particles was discussed. Some corresponding prevention measures were proposed.