On the MOSFET-Based Temperature Sensitive Element for Bolometer Application
On the MOSFET-Based Temperature Sensitive Element for Bolometer Application
参考文献7
-
1Moreno, M., Torres, A., Ambrosio, R., and Kosarev, A. 2012. Un-cooled Microbolometers with Amorphous Germanium-Silicon (a-GexSiy: H) Thermo-Sensing Films.
-
2Vedel, C., Martin, J. L., Ouvrier Buffet, J. L., Tissot, J. L., Vilain, M., and Yon, J. J. 1999. "Amorphous Silicon Based Uncooled Microbolometer IRFPA". In Proceedings SPIE 3698, Infrared "Technology and Applications XXV, 276.
-
3Lapadatu, A., Kittisland, G., Elfving, A., Hohler, E., Kvisteroy, T., Bakke, T., and Ericsson, P. 2010. "High-Performance Long Wave Infrared Bolometer Fabricated by Wafer Bonding." In Proceedings SPIE 7660, Infrared Technology and Applications XPLYVI, 766016.
-
4Forsberg, F. 2013. "VLSHI (Very Large Scale Heterogeneous Integration) and Wafer-Level Vacuum Packaging for Infrared Bolometer Focal Plane Arrays." Infrared Physics & Technology 60:251-9.
-
5Kropelnicki, P., and Vogt, H. 2010. "A New DC-Temperature Model for a Diode Bolometer Based on SOI-Pin-Diode Test Structures." In 2010 XIth International Workshop on Symbolic and NumericalMethods, Modeling and Applications to Circuit Design 1-4.
-
6Takamuro, D., Maegawa, T., Sugino, T., Kosasayama, Y., Ohnakado, T., Hata, H., Ueno, M., Fukumoto, H., Ishida, K., Katayama, H., Imai, T., and Ueno, M. 2011. "Development of New SOl Diode Structure for beyond 17 ~tm Pixel Pitch SOI Diode Uncooled IRFPAs". InProceedings SPIE 8012, Infrared Technology and Applications XXXVII, 80121E.
-
7Socher, E., Beer, S. M., and Nemirovsky, Y. 2005. "Temperature Sensitivity of SOI-CMOS Transistors for Use in Uncooled Thermal Sensing." IEEE Transactions on Electron Devices 52 (12): 2784-90.
-
1黄宗坦,苏培超,曾光丽,薛南屏.高温超导Bolometer的原理性实验[J].红外技术,1989,11(3):19-21. 被引量:3
-
2杨德嘉,邵凯,经东,王子良,过海洲.高温超导Bolometer研制[J].固体电子学研究与进展,1991,11(4):357-358. 被引量:1
-
3张文涛,戴静云,孙宝臣.一种新型金属封装的光纤法珀温度传感器[J].微纳电子技术,2007,44(7):207-209. 被引量:1
-
4胡建成.半导体激光器温度特性研究[J].黑龙江科技信息,2011(4):8-8.
-
5张鑫,李纲民,谭.简便而又实用的热电阻测温方法[J].电气传动自动化,2003,25(4):61-62. 被引量:3
-
6李晶晶,岳瑞峰,刘理天.一种使用改进力敏差放的压力传感器设计[J].仪器仪表学报,2002,23(z2):595-596.
-
7谢檬,张安莉.虚拟温湿度监测系统的设计[J].电子设计工程,2014,22(10):163-165.
-
8电子工艺选择性焊接:PCB设计者新选择[J].电子电路与贴装,2005(6):12-12.
-
9陈果,杨英,顾丽敏.机电产品温度敏感元件温度特性自动采集系统的设计[J].机械研究与应用,2016,29(5):185-187.
-
10REN Yuan,MIAO Wei,YAO Qi-Jun,ZHANG Wen,SHI Sheng-Cai.Terahertz Direct Detection Characteristics of a Superconducting NbN Bolometer[J].Chinese Physics Letters,2011,28(1):50-53. 被引量:1