迈克耳孙干涉仪旋转样品法测量透明玻璃厚度

Rotating sample method to measure thickness of transparent glass wafer using Michelson interferometer

使用迈克耳孙干涉仪通过旋转样品测量透明玻璃厚度.与白光干涉原理测薄片厚度不同,实验通过改变在光的传播路径上垂直放置的透明玻璃与光传播方向的角度,使相干光的干涉条纹发生变化,利用干涉条纹与转过角度、透明玻璃厚度之间的关系,通过实验准确测量出透明玻璃的厚度.

A rotating sample method to measure the thickness of transparent glass wafer was proposed using a Michelson interferometer. In comparison to the traditional method based on the interference of white beams, the different interference fringes were generated by changing the angle between the wafer and the light. The thickness of the transparent glass wafer was accurately measured according to the changes of the fringes and the rotation angle.