高速高精度印刷电路板表面贴装自动光学检测系统的研究

Research of Automatic Optical Inspection System of Printed Circuit Board for High Speed and High Precision Surface Mounting

为满足高精密度、微型化印刷电路板表面贴装要求,实现全自动、可靠性高、速度快的贴装生产,研究了一种新的自动光学检测系统。该装置主要由光路系统、线阵摄像机、量化存储单元、模板库、专用高速图像处理单元、监视单元等模块组成,实现设备标定、缺陷识别、对中校正和位姿补偿等功能。实验证明:该检测系统可以满足高精密度印刷电路板的高速高精度贴装生产的实时检测要求,达到了较好的检测效果。

In order to meet the requirements of high precision and miniaturization of surface-mount for printed circuit boards,re-alize the SMT production of fully automation,high reliability and high speed,a new kind of automatic optical inspection system was re-searched. The device was mainly composed of optical path system,the linear array camera,quantitative storage unit,template library, dedicated high-speed image processing unit and monitoring unit,and other modules,which could realize functions of equipment cali-bration,defect recognition,alignment correction and compensating for the position,and so on. The experiments prove that the system can satisfy the real-time detection requirements for high precision and high speed mounting of the high precision of printed circuit boards in production,which achieves better detection result.