Asymmetry in interface and bending property of Al/Cu/Al bimetallic laminates

This work was aimed to study the interfacial microstructures and three-point bending properties of Al/Cu/Al bimetallic laminates produced by the asymmetrical roll bonding and annealing. It is found that the microstructure and bonding strength of the Al/Cu interface are different with those of the Cu/Al interface. The interfacial microstructure of Cu/Al interface is improved due to the large interfacial plastic deformation caused by the different rotation speeds of roll in the asymmetrical roll bonding process. The bonding strength between Al and Cu layer can be enhanced by the moderate atomic diffusion, but is dramatically depressed by the formation of intermetallic compounds in the interface.The bending strength of bimetallic laminates is enhanced when the Cu/Al interface is loaded in tension because of the improvement of stress transition and damping by the Cu/Al interface during the three-point bending deformation. The bending fracture reveals that the interfacial cracks can be inhibited from the restricted stress concentration in the improved Cu/Al interface.