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Preparation of Mo_2C nanoparticles dispersion-strengthened copper-based composite by EB-PVD 被引量:2

Preparation of Mo_2C nanoparticles dispersion-strengthened copper-based composite by EB-PVD
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摘要 In this research, a nano-Mo2 C particle dispersion-strengthened copper alloy was prepared by a novel method, i.e., electron beam physical vapor deposition(EBPVD) which has advantages of simple technical process and low cost compared with the conventional mechanical alloying method. And the microstructure and properties of the material were investigated. The results show that the copper matrix is composed of columnar crystals with the average width of 7 lm, and the size of Mo2 C dispersoid is1–7 nm. The ultimate tensile strength of the material is486 MPa, and the electrical conductivity is 82 % IACS. As the temperature increases from 293 to 573 K, the material becomes more brittle. In this research, a nano-Mo2 C particle dispersion-strengthened copper alloy was prepared by a novel method, i.e., electron beam physical vapor deposition(EBPVD) which has advantages of simple technical process and low cost compared with the conventional mechanical alloying method. And the microstructure and properties of the material were investigated. The results show that the copper matrix is composed of columnar crystals with the average width of 7 lm, and the size of Mo2 C dispersoid is1–7 nm. The ultimate tensile strength of the material is486 MPa, and the electrical conductivity is 82 % IACS. As the temperature increases from 293 to 573 K, the material becomes more brittle.
出处 《Rare Metals》 SCIE EI CAS CSCD 2014年第5期568-572,共5页 稀有金属(英文版)
基金 financially supported by the National Natural Science Foundation of China (Nos. 51104131 and 51201152) Heilongjiang Provincial Natural Science Foundation of China (No. E201247) the Open Fund of Zhejiang Provincial Top Key Discipline (No. 20110929)
关键词 Electron beam physical vapor deposition Dispersion-strengthened copper ODS IN-SITU Electron beam physical vapor deposition Dispersion-strengthened copper ODS In-situ
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