基于COHS封装光源的模块热分析与测试

Module Thermal Analysis and Testing Based on the COHS Encapsulation Light Source

基于散热器载覆芯片(COHS)封装光源的模块为研究对象,建立了有限元模型,以有限元分析软件Flo EFD和测温实验为平台,模拟分析了光源模块从启动到稳定工作过程中的温度分布,并对实际光源模块的几个特征点进行了温度测试。结果表明除了在散热器边沿测试点的模拟计算结果与实测结果之间有所偏差外,其他特征点的结果吻合很好,模拟分析的方法及结果符合热分析要求。分析数据和研究结果为今后研究大功率LED灯具的模块化、系列化提供了参考依据。

Based on the research of the module that light source packaged by chip on heat sink （COHS） , a finite element model of the light source module was established. The finite element analysis was carried out to simulate the distributions of temperature in the light source module from start to the steady working process on the platform of the finite element analysis software FloEFD and the temperature measuring experiment, and the temperature of the typical points at the realistic light source module was measured. The results show that in addition to some deviation between simulation results and the mea- sured results on the edge of the radiator test point, the results of other feature points are in good agree- ment. The simulation methods and analysis results meet the requirements of thermal analysis. The analy- sis of data and the test results provide a reference for research modularization and serialization of the high- power LED lamps in future.