摘要
针对小型裸芯片的组装特点,特别是GaAs等薄脆材料,低压力贴装非常重要。简要介绍了组装系统贴装头的结构及其优点,重点阐述了贴装力的测定方法,给出了贴装力与超行程的关系,并结合贴装吸嘴形式和运动控制方式验证其可行性,通过工艺实验,组装系统的压力完全满足裸芯片贴装的要求。
Low pressure placement is very important according to the characteristics of the small bare chip assembly, especially for thin and gragile materials like GaAs. This paper briefly introduces the structure and advantages of the assembly system head, focusing on the measure method of low pressure mounted force, given the relationship of mounted force and over travel. The paper verifies the possibility according to the relationship between vacuum nozzles shape and with the movement control mode. Through the process test, the assembly system pressure meets the requirements of the bare chip assembly.
出处
《电子工业专用设备》
2014年第8期31-34,58,共5页
Equipment for Electronic Products Manufacturing
关键词
组装系统
低压力贴装
超行程
Assembly system
Low force placement
Overtravel
