摘要
为了实现钨螺旋线表面镀金薄膜质量可控,研究了无氰电镀过程中工艺参数如电流密度、镀液温度和沉积时间对镀金层质量的影响规律。利用扫描电子显微镜对镀金层形貌进行观察分析。结果表明:电流密度影响镀金薄膜的表面平整度及晶粒大小;镀液温度影响无氰镀液稳定性,从而影响薄膜的表面光泽度及平整度;电沉积时间对镀层覆盖效果影响较大。沉积时间过短,镀层覆盖效果差;时间过长,边角效应严重。沉积时间宜控制在1.5 h内。
To control the surface quality of gold films electrodeposited on tungsten helix, the effects of current density, electrolytic temperature and deposition time on the electrodeposits were studied. The morphology of gold films was evaluated by means of scanning electron microscope （SEM）. The results indicate that current density affects the grain size of the film. When electrodepositing at higher current density, the surface defects such as burring and sponge feature the gold film. The electrolytic temperature causes poorer stability of electrolytic solution and deposition quality. In addition, the variation of deposition time results in different electrodeposits quality. With increasing the deposition time, the edge effect is serious. The proper deposition time is about 1.5 h
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2014年第11期2847-2850,共4页
Rare Metal Materials and Engineering
关键词
钨螺旋线
镀金
电流密度
镀液温度
沉积时间
tungsten helix
gold film
current density
electrolytic temperature
deposition time
