胶厚对单搭粘接接头强度影响的试验与仿真研究

RESEARCH ON THE INFLUENCES OF BONDLINE THICKNESS ON STRENGTH OF ADHESIVEL BONDING OF SINGLE LAP JOINTS BASED ON EXPERIMENT AND SIMULATION

为研究不同胶层厚度对单搭粘接接头强度的影响,对胶层厚度为0.2 mm、0.7 mm、1.5 mm和2.5 mm的铝5052-铝5052(Al5052-Al5052)单搭粘接接头进行拉伸-剪切试验,对比不同胶厚对Al5052-Al5052单搭粘接接头强度的影响。仿真分析考虑材料非线性和几何非线性,模拟不同胶层厚度表面上的等效应力的分布情况,研究结果表明:胶层厚度影响粘接剂对Al5052-Al5052单搭粘接接头的粘接效果,胶层表面的von Mises应力随着胶层厚度的增加而增大,Al5052-Al5052单搭粘接接头的强度随着胶层厚度的增加而降低。

In order to explore the strength of the structure with lap joints, the adhesive bonding single of single lap joints with differential bondfline thickness were tested in tension loading which creates shear across the bondline. The equivalent stress was obtained through finite element analysis to define the effect of bondline thickness, which helped to get the conclusions that equivalent stress of bondline increasing as the bondline thickness increasing, that the strength of adhesive bonding of single of single lap joints decreasing as the bondline thickness increasing.