摘要
随着人们环保意识的提高,无铅焊料替代传统的锡铅焊料成为电子行业的必然趋势。Sn-Zn系无铅焊料因为熔点接近传统锡铅焊料,且具有优良的力学性能而被广泛关注,有望替代传统焊料。目前Sn-Zn系无铅焊料在润湿性、抗氧化性、抗腐蚀性等方面存在一定的问题。其中,焊料的抗腐蚀性对电子产品的寿命和安全起着决定性作用,因此,具有良好的抗腐蚀性能是开发无铅焊料的关键之一。就当下研究比较成熟的Sn-Zn系焊料的抗腐蚀性能进行研究。指出了元素合金化对Sn-Zn焊料的影响,并对抗腐蚀机理进行阐述。
With the improvement of people＆#39;s environmental awareness, lead-free solder alternative to conventional tin lead solders has become an inevitable trend in electronic industry. Because of the melting point close to the traditional tin lead solder and excellent mechanical properties, Sn-Zn lead-free solders has been widely concerned and is expected to replace the traditional solder. The Sn-Zn lead-free solder has some problems in the wettability, oxidation resistance, corrosion resistance etc, moreover, the corrosion resistance of solder for electronics life and safety plays a decisive role. Therefore, having a good corrosion resistance is one of the key ways of lead-free solders’ development. Study on the corrosion resistance of Sn-Zn lead-free solders which have been researched most, then points the effect of alloying elements on Sn-Zn solder and discusses the mechanism of corrosion resistance.
出处
《电子工艺技术》
2014年第6期316-320,共5页
Electronics Process Technology
基金
广西"千亿元"产业重大科技攻关项目(项目编号:桂科攻11107003-1)
广西高校科学技术研究项目(项目编号:2013ZL010)
