高海拔地区电子设备散热分析

Heat Dissipation Analysis of Electronic Equipment in High Altitude Area

电子设备机箱散热能力不仅会影响其稳定性,也会影响各元器件的使用寿命,特别是在空气稀薄、气压低的高海拔地区,封闭机箱散热性能更差.为研究高海拔地区电子设备的散热问题,基于湍流理论,建立了机箱冷却流场数学模型;采用ICEPAK电子热设计专用软件,对不同海拔高度的散热问题进行了仿真分析,提出了两方程的湍流模型对空气稀薄地区散热计算更为准确的理论,并通过仿真分析得到了验证,为高海拔地区电子设备的散热设计提供参考.

Heat dissipation capacity of electronic equipment influences not only its stability, but the service life of the components. Especially in the high-altitude area with thin air and low air pressure, heat dissipation performance is more likely to deteriorate in closed chassis. In order to study heat dissipation problem of elec- tronic equipment at the high altitude, based on the turbulence theory, cooling flow mathematical model of chassis was established. By means of ICEPAK, an electronic thermal design specialized software, the heat dis- sipation of different altitudes were simulated. The theory that two-equation turbulence model for cooling calcu- lation in thin air area should be more accurate, was put forward and verified through the simulation. This will provide a reference for the thermal design of electronic equipment in high altitude areas.