摘要
针对带引脚表贴器件在热、振动条件下的互联疲劳寿命模型开展研究,通过将有限元法和失效机理模型结合建立了互联疲劳寿命分析方法流程;以四面扁平封装(QFP)为例进行了互联疲劳寿命计算,得出振动环境下的疲劳寿命为1.64×107个循环;在温度循环条件下危险焊料的疲劳寿命为3 512周。
The interconnection fatigue life model of surface mounted components with lead was studied based on conditions of thermal and vibration,and connecting of finite element method and failure mechanism model,interconnection fatigue life analysis flow was established. The fatigue life of QFP was calculated as an example. Results show that the fatigue life in condition of vibration is 1.64×10^7 cycles,and the fatigue life of thermal cycle is 3 512 cycles.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第12期98-102,共5页
Electronic Components And Materials
关键词
带引脚表贴器件
热疲劳
振动疲劳
互联疲劳寿命
有限元法
失效机理模型
surface mounted component with lead
thermal fatigue
vibration fatigue
interconnection fatigue life
finite element method
failure mechanism model
